Anti static foam packaging is not only used in the field of microelectronic products, such as the turnover and packaging of chips, semiconductors, PCB , active and passive components, etc., but also widely used as packaging materials in the power industry, such as Busbars and Brackets packaging and shipping; It can also be used as a cushion lining in the luggage industry, such as: Insert of Explore Case
Cases applied to the electronic field:
Chips & Foam tray for holding
Active Components & Foam Tray for Active Components
&Design Drawing for Packaging Active Devices